Anwendung und Charakterisierung von Leitklebstoffverbindungen für gebäudeintegrierte Photovoltaik-Fassadenelemente

Abstract

This study focuses on the development and evaluation of lead-free photovoltaic facade modules, with an emphasis on their reliability. The core objective is to utilize electrically conductive adhesives (ECA) as an alternative to traditional soldered connections. The aim is to investigate the properties and durability of these modules through innovative manufacturing techniques and comprehensive testing methods to assess their suitability for facade applications. Initially, the characterization of the adhesives is carried out using Differential Scanning Calorimetry (DSC) to identify optimal curing parameters. The mechanical stability of the string interconnections is evaluated through peel tests, while climate tests according to DIN EN 61730 and IEC 61215 standards assess the modules’ resistance to environmental influences. Soldered connections and various adhesive types, including epoxy- and acrylate-based variants, are also compared. The modules are manufactured using specific material combinations and lamination processes, which are subsequently tested for defects such as cracks and contact issues. Electrical power measurements under standard test conditions show the power values and efficiencies that can be achieved by ECA-connected modules. However, the findings also highlight the impact of mechanical damage and manufacturing defects on performance, emphasizing the need for further cyclic stress testing. This work not only contributes to the advancement of sustainable photovoltaic technologies but also provides valuable insights for the integration of lead-free modules into modern facade applications.